What is an Outside Planet Engineer?

 The task of “Clean” is to clean natural contaminants such as oil, fingerprints, rust films, etc. so that the surface of the metal foil is clean and shiny, which is the basic necessity. This step plays an important role in quality control. Poor cleaning will cause an uneven thickness of the protective materials. To ensure the high quality of the finished OSP film, on the one hand, the observation of the cleaning solution at different levels must be monitored by chemical laboratory analysis. On the other hand, it is recommended to check the cleaning effect as often as possible and, once the effect does not reach the level, the cleaning solution should be changed immediately.

In the process of improving landscaping, micro-etching is often used to iron out the copper by removing ruga dioxide, thus improving the connection between the metal and the copper OSP solution. The micro-etch rate directly affects the rate of film formation. Therefore, it is important to maintain stability even at low speeds to obtain a smooth and thick film. In general, it is better to control the speed at a low speed of 1.0 to 1.5 μm per minute.

If the OSP solution is contaminated with other ions and causes poisoning after the weld breaks, it is best to use mouthwash DI before protecting the protective material. Also, if contamination destroys the residue, it is best to use a DI rinse after preservative to set the pH value between 4.0 and 7.0.

PCB removal requirements that are covered with OSP

Because the protection provided by OSP technology is so thin and easy to cut, great care must be taken in the work and loading process. PCBs with OSP surface finish are so long under heat and moisture that oxidation will occur on the surface of the PCB, which will reduce soldering. Therefore, storage methods must comply with the following principles:

a. The vacuum pack should be used with a desiccant and a liquid display card. Place the release paper between the PCBs to prevent friction from destroying the surface of the PCB.

b. These PCBs cannot be exposed to direct sunlight. The requirements for the best storage environment are: relative humidity (30-70% RH), temperature (15-30 ° C) and storage time (less than 12 months).

Possible OSP problem after welding

Occasionally, the color of OSP tables changes after pasting, which often has something to do with the thickness of the pediments, the amount of micro-particles, gain times, and even abnormal cracks. Fortunately, this research is only visible from the first moment. In general, there are two situations:

For line 1, during the welding process, the flux can help eliminate oxidation so that the welding performance is not affected. Consequently, the criteria should no longer be adopted. Instead, case number 2 occurs because the OSP unit has been destroyed so that the flux cannot remove the oxidations, which will greatly reduce the welding performance.

Therefore, the following improvements and measures must be taken to ensure the appearance and performance of the surface finish of weldable organic preservatives:

a. The thickness of the OSP must be controlled within a certain range;

second. The amount of micro gravure must be controlled within a certain range;